Wafer glue uniformizing equipment

The invention discloses wafer glue uniformizing equipment which comprises the components of a supporting member which is provided with three positioning groups, the three positioning groups are uniformly arranged at intervals along the circumferential direction of a first circumference, and each positioning group comprises a plurality of positioning holes which are arranged along the radial direction of the first circumference; the three positioning pieces are in one-to-one correspondence with the three positioning groups, and the positioning pieces are detachably connected with the positioning holes; the suction cup is arranged on the supporting piece and located among the three positioning pieces. The rotating mechanism is used for driving the supporting piece to rotate in the circumferential direction of the first circumference; a glue supply mechanism; and the glue dripping pipe is connected with the glue supply mechanism and is arranged above the sucking disc. A wafer is placed on the suction cup and amo