Removal of by-products from electroplating solutions

Systems and methods for electroplating are provided. An electroplating system may include an electroplating bath configured to include an anode and an electroplating solution, a wafer holder configured to support a wafer within the electroplating bath, a reservoir configured to include at least a portion of the electroplating solution, a recirculation flow path fluidly connecting the reservoir and the electroplating bath, wherein the recirculation flow path includes a pump and is configured to circulate the plating solution between the reservoir and the plating bath, and a bubbler in fluid connection with one or more of the plating bath, the reservoir, and the recirculation flow path. The bubbler may be configured to generate bubbles in the electroplating solution when the electroplating solution is present in the electroplating system, interfaces with the bubbler, and the bubbler is activated. 提供了用于电镀的系统和方法。电镀系统可包括配置为包含阳极和电镀溶液的电镀槽、配置为在电镀槽内支撑晶片的晶片支架、配置为包含电镀溶液的至少一部分的储液槽、流体连接所述储液器和所述电镀槽的再循环流动路径，其中再循环流动路径包括泵并且被配