Vertical transmission device for circuit board hole metallization

The invention discloses a vertical transmission device for circuit board hole metallization, which belongs to the technical field of vacuum equipment and comprises a transportation assembly module, a guide rail module, a bias power-on module, a power transmission module and a cavity supporting module. Through the arrangement of the bias power-on module and the transportation assembly module, the working voltage can be continuously and stably applied when the PCB moves in the sputtering process, the uniformity and depth of a hole film layer are ensured, and a transmission device and a vacuum chamber are well insulated without a short circuit phenomenon; through the arrangement of the transportation assembly module, the device can adapt to PCBs with different thicknesses and is convenient to disassemble and replace; the transmission device is vertically arranged, plated objects at other positions of the cavity cannot fall onto the PCB, the cleaning cost is reduced, double-face hole plating of the PCB can be con