Stereoscopic discrete device and control module

The invention relates to the technical field of semiconductor devices, in particular to a three-dimensional discrete device and a control module.The three-dimensional discrete device comprises a chip and a metal bonding wire frame, the bonding wire frame comprises a frame top and a frame bottom which are vertically adjacent, and the frame top comprises a supporting face and a plurality of side faces connected in sequence; the bonding wire frame is provided with heat dissipation holes for heat dissipation media to pass through, the heat dissipation holes at least penetrate through the supporting face, and the chip is fixed to the side face. Each side surface of the three-dimensional bonding wire frame is provided with a chip, so that the number of the chips is increased, and the discrete device can achieve super power; the bonding wire frame is arranged to be a metal frame, the chip can quickly conduct heat to the bonding wire frame for heat dissipation, the heat dissipation holes are formed in the bonding wir