Wafer gluing process optimization method

The invention discloses a wafer gluing process optimization method. The method comprises the following steps: firstly, determining a jig, a glue type and a glue attribute of a gluing process; then determining a cleaning process for the machined part before gluing; determining processing process para...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	FENG HOUQING, MA MIANZHI, SHI ZHIYU, LI XINGLI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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