Wafer gluing process optimization method

The invention discloses a wafer gluing process optimization method. The method comprises the following steps: firstly, determining a jig, a glue type and a glue attribute of a gluing process; then determining a cleaning process for the machined part before gluing; determining processing process parameters, wherein the processing process range comprises the selection of the pressure of a gluing scraper, the blade coating speed, the working mode of the scraper and the specification of a steel mesh; and determining a baking process curve after gluing. Finally, the optimized process parameters are verified through verification indexes, and when the wafer is glued through the optimized back face gluing process, the precision is high, and the requirement for batch production can be met. 本发明公开了一种晶圆涂胶的工艺优化方法，该方法首先确定涂胶工艺的治具、胶水类型和胶水属性；然后确定涂胶前对加工件的清洗工艺；确定加工的工艺参数，所述加工的工艺范围包括涂胶的刮刀压力、刮涂速度、刮刀工作模式、钢网规格的选择；确定涂胶后的烘烤工艺曲线。最后通过验证指标对优化后的工艺参数进行验证，优化后的背面涂胶工艺涂胶晶圆时，精度高，能够满足批量生产。