Interface of semiconductor device and method for arranging and combining interface of semiconductor device

The invention provides an interface of a semiconductor device and an interface method for arranging and combining the semiconductor device. An interface of a semiconductor device includes a master device and a plurality of slave devices. The interface comprises a main interface and a slave interface. A primary interface is implemented in the primary device and includes a primary bond pattern formed of primary bonds arranged in a first array. A slave interface is implemented in each slave device and includes a slave bond pattern formed of slave bonds arranged in a second array. The first array of primary junctions includes a first center row and a first set of data rows divided into two portions that are fully symmetrical with respect to the first center row. A second array of slave connectors includes a second center row and a second set of data rows divided into two portions that are fully symmetrical with respect to the second center row. The first center row is aligned with the second center row in a chip-