Method for manufacturing electronic device
The invention provides a manufacturing method of an electronic device. The manufacturing method comprises the following steps: providing a first substrate and a second substrate; attaching an adhesive member on the first substrate; and executing a bending and attaching step to enable the first subst...
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| creator | LIU CHENGWEI ZHOU CHENGCHUN ZHOU FANGCHENG |
| description | The invention provides a manufacturing method of an electronic device. The manufacturing method comprises the following steps: providing a first substrate and a second substrate; attaching an adhesive member on the first substrate; and executing a bending and attaching step to enable the first substrate and the second substrate to be attached to each other through the adhesion piece, and forming a bending composite assembly, wherein the step of bending and bonding is performed at a temperature ranging from 20 DEG C to 160 DEG C.
本公开提供一种电子装置的制造方法，包括：提供一第一基板及第二基板；贴附一黏着件在第一基板上；以及执行一弯曲贴合步骤，使第一基板与第二基板经由黏着件而彼此贴合，且形成一弯曲复合组件；其中，弯曲贴合步骤是在温度为20℃至160℃的范围内执行。 |
| format | Patent |
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本公开提供一种电子装置的制造方法，包括：提供一第一基板及第二基板；贴附一黏着件在第一基板上；以及执行一弯曲贴合步骤，使第一基板与第二基板经由黏着件而彼此贴合，且形成一弯曲复合组件；其中，弯曲贴合步骤是在温度为20℃至160℃的范围内执行。</description><language>chi ; eng</language><subject>ADVERTISING ; CALCULATING ; COMPUTING ; COUNTING ; CRYPTOGRAPHY ; DISPLAY ; DISPLAYING ; EDUCATION ; ELECTRIC DIGITAL DATA PROCESSING ; LABELS OR NAME-PLATES ; PHYSICS ; SEALS ; SIGNS</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220412&DB=EPODOC&CC=CN&NR=114327107A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220412&DB=EPODOC&CC=CN&NR=114327107A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LIU CHENGWEI</creatorcontrib><creatorcontrib>ZHOU CHENGCHUN</creatorcontrib><creatorcontrib>ZHOU FANGCHENG</creatorcontrib><title>Method for manufacturing electronic device</title><description>The invention provides a manufacturing method of an electronic device. The manufacturing method comprises the following steps: providing a first substrate and a second substrate; attaching an adhesive member on the first substrate; and executing a bending and attaching step to enable the first substrate and the second substrate to be attached to each other through the adhesion piece, and forming a bending composite assembly, wherein the step of bending and bonding is performed at a temperature ranging from 20 DEG C to 160 DEG C.
本公开提供一种电子装置的制造方法，包括：提供一第一基板及第二基板；贴附一黏着件在第一基板上；以及执行一弯曲贴合步骤，使第一基板与第二基板经由黏着件而彼此贴合，且形成一弯曲复合组件；其中，弯曲贴合步骤是在温度为20℃至160℃的范围内执行。</description><subject>ADVERTISING</subject><subject>CALCULATING</subject><subject>COMPUTING</subject><subject>COUNTING</subject><subject>CRYPTOGRAPHY</subject><subject>DISPLAY</subject><subject>DISPLAYING</subject><subject>EDUCATION</subject><subject>ELECTRIC DIGITAL DATA PROCESSING</subject><subject>LABELS OR NAME-PLATES</subject><subject>PHYSICS</subject><subject>SEALS</subject><subject>SIGNS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNDyTS3JyE9RSMsvUshNzCtNS0wuKS3KzEtXSM1JTS4pys_LTFZISS3LTE7lYWBNS8wpTuWF0twMim6uIc4euqkF-fGpxQWJyal5qSXxzn6GhibGRuaGBuaOxsSoAQBIIik5</recordid><startdate>20220412</startdate><enddate>20220412</enddate><creator>LIU CHENGWEI</creator><creator>ZHOU CHENGCHUN</creator><creator>ZHOU FANGCHENG</creator><scope>EVB</scope></search><sort><creationdate>20220412</creationdate><title>Method for manufacturing electronic device</title><author>LIU CHENGWEI ; ZHOU CHENGCHUN ; ZHOU FANGCHENG</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN114327107A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2022</creationdate><topic>ADVERTISING</topic><topic>CALCULATING</topic><topic>COMPUTING</topic><topic>COUNTING</topic><topic>CRYPTOGRAPHY</topic><topic>DISPLAY</topic><topic>DISPLAYING</topic><topic>EDUCATION</topic><topic>ELECTRIC DIGITAL DATA PROCESSING</topic><topic>LABELS OR NAME-PLATES</topic><topic>PHYSICS</topic><topic>SEALS</topic><topic>SIGNS</topic><toplevel>online_resources</toplevel><creatorcontrib>LIU CHENGWEI</creatorcontrib><creatorcontrib>ZHOU CHENGCHUN</creatorcontrib><creatorcontrib>ZHOU FANGCHENG</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LIU CHENGWEI</au><au>ZHOU CHENGCHUN</au><au>ZHOU FANGCHENG</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Method for manufacturing electronic device</title><date>2022-04-12</date><risdate>2022</risdate><abstract>The invention provides a manufacturing method of an electronic device. The manufacturing method comprises the following steps: providing a first substrate and a second substrate; attaching an adhesive member on the first substrate; and executing a bending and attaching step to enable the first substrate and the second substrate to be attached to each other through the adhesion piece, and forming a bending composite assembly, wherein the step of bending and bonding is performed at a temperature ranging from 20 DEG C to 160 DEG C.
本公开提供一种电子装置的制造方法，包括：提供一第一基板及第二基板；贴附一黏着件在第一基板上；以及执行一弯曲贴合步骤，使第一基板与第二基板经由黏着件而彼此贴合，且形成一弯曲复合组件；其中，弯曲贴合步骤是在温度为20℃至160℃的范围内执行。</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
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| subjects | ADVERTISING CALCULATING COMPUTING COUNTING CRYPTOGRAPHY DISPLAY DISPLAYING EDUCATION ELECTRIC DIGITAL DATA PROCESSING LABELS OR NAME-PLATES PHYSICS SEALS SIGNS |
| title | Method for manufacturing electronic device |
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