Method for manufacturing electronic device

The invention provides a manufacturing method of an electronic device. The manufacturing method comprises the following steps: providing a first substrate and a second substrate; attaching an adhesive member on the first substrate; and executing a bending and attaching step to enable the first substrate and the second substrate to be attached to each other through the adhesion piece, and forming a bending composite assembly, wherein the step of bending and bonding is performed at a temperature ranging from 20 DEG C to 160 DEG C. 本公开提供一种电子装置的制造方法，包括：提供一第一基板及第二基板；贴附一黏着件在第一基板上；以及执行一弯曲贴合步骤，使第一基板与第二基板经由黏着件而彼此贴合，且形成一弯曲复合组件；其中，弯曲贴合步骤是在温度为20℃至160℃的范围内执行。