Polyimide positive photoresist composition and application thereof

The invention provides a polyimide positive photoresist composition. The polyimide positive photoresist composition comprises a resin component; a cross-linking agent; a photosensitizer; and a solvent. Wherein the resin component comprises 30 wt% to 90 wt% of polyimide resin; from 1 wt% to 60 wt% of...

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Bibliographische Detailangaben
Hauptverfasser:	LIN YIJIE, LIN CHAO WEN, YE ZITANG, HUANG XINYI, ZHOU NAITIAN, LI ZHENLI, LIN BONAN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	The invention provides a polyimide positive photoresist composition. The polyimide positive photoresist composition comprises a resin component; a cross-linking agent; a photosensitizer; and a solvent. Wherein the resin component comprises 30 wt% to 90 wt% of polyimide resin; from 1 wt% to 60 wt% of a bisphenol-based resin; and 0.1 wt% to 10 wt% of a polysilane resin. The invention also provides an application of the photoresist composition. 本发明提供一种聚酰亚胺正型光阻组成物，包括：一树脂成分；一交联剂；一感光剂；以及一溶剂。其中，树脂成分包括：30wt％至90wt％之聚酰亚胺树脂；1wt％至60wt％之双酚类树脂；以及0.1wt％至10wt％之聚硅烷树脂。本发明还提供前述光阻组成物的用途。