Missile-borne electronic equipment anti-high overload vibration filling and sealing device and filling and sealing method

The invention relates to a high-overload-resistant vibration filling and sealing device and method for missile-borne electronic equipment. The filling and sealing device is composed of a vibration filling and sealing platform and a clamping tool. The potting process comprises the following steps: preparing a potting adhesive and carrying out defoaming treatment; clamping the electronic equipment; setting encapsulation parameters; performing vibration encapsulation; and curing the pouring sealant. According to the invention, the high-viscosity pouring sealant is used as a pouring material, a special spiral vibration pouring platform is utilized, and proper vibration parameters such as amplitude and frequency are designed, so that the defects of incompact pouring, more pouring bubbles and the like which are easily generated in the traditional pouring method are overcome, and the high-viscosity pouring sealant based on the high-viscosity and double-component pouring sealant is obtained. The invention relates to