Glue injection method for downhole instrument
The invention provides a glue injection method for a downhole instrument, which comprises the following steps: putting the downhole instrument into a first mold, and injecting a first glue solution to form a first glue body coating the downhole instrument; taking out the first colloid from the first...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention provides a glue injection method for a downhole instrument, which comprises the following steps: putting the downhole instrument into a first mold, and injecting a first glue solution to form a first glue body coating the downhole instrument; taking out the first colloid from the first mold, and carrying out a first performance test on the first colloid; putting the first colloid into a second mold, and injecting a second glue solution to form a second colloid wrapping the first colloid; and taking out the second colloid from the second mold, and carrying out a second performance test on the second colloid.
本发明提供了一种用于井下仪器的注胶方法,包括如下步骤:将井下仪器放入第一模具中,注入第一胶液,形成包覆井下仪器的第一胶体;从第一模具中取出第一胶体,并对第一胶体进行第一次性能测试;将第一胶体放入第二模具中,注入第二胶液,形成包覆第一胶体的第二胶体;从第二模具中取出第二胶体,并对第二胶体进行第二次性能测试。 |
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