High-end manufacturing plate cutting and polishing device

The invention relates to a cutting and polishing device, in particular to a cutting and polishing device for high-end manufactured plates. The invention aims to provide the high-end manufactured plate cutting and polishing device which is relatively high in working efficiency and can automatically c...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: LIAO LECHENG
Format: Patent
Sprache:chi ; eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:The invention relates to a cutting and polishing device, in particular to a cutting and polishing device for high-end manufactured plates. The invention aims to provide the high-end manufactured plate cutting and polishing device which is relatively high in working efficiency and can automatically collect sweeps. The high-end manufacturing plate cutting and polishing device comprises a base, a mounting frame, a cutter, a cutting device and a polishing device, the mounting frame is arranged at the top of the base, the cutting device is arranged at the top of the mounting frame, the cutter is arranged on the cutting device, and the polishing device is arranged on one side of the top of the base. Through cooperation of the cutter, the cutting device and the polishing device, a plate can be automatically cut off and polished, the working efficiency is improved, and the safety is high; by means of the pressing device, the plate can be pressed when the cutter cuts off the plate, and the cut-off plate can be prevent