Optical material laser cutting device and cutting process thereof

The invention relates to an optical material laser cutting device and a cutting process thereof.The optical material laser cutting device comprises a workbench, a moving block, an X-axis driving part used for driving the moving block to move in the X-axis direction and a Y-axis driving part used for driving the X-axis driving part to move, and further comprises a laser device arranged on the moving block; the galvanometer is arranged on the moving block, and a light outlet of the galvanometer is vertically downward; and laser emitted by the laser enters the galvanometer through the light path reflection assembly and is finally emitted out from a light outlet of the galvanometer for cutting. The cutting device has the effect of effectively improving the cutting efficiency. 本申请涉及一种光学材料激光切割装置及其切割工艺，包括工作台、移动块、用于带动移动块沿着X轴方向移动的X轴驱动件以及用于带动X轴驱动件移动的Y轴驱动件，还包括：激光器，激光器设置在移动块上；振镜，振镜置于移动块上，振镜的出光口竖直向下；光路反射组件，激光器发出的激光经光路反射组件进入到振镜并最终从振镜的出光口射出进行切割。本申请具有有效提高切割效率的效果。