Plate positioning and cutting method and device
The invention provides a plate positioning and cutting method and device, and belongs to the technical field of plate machining. The plate positioning and cutting method comprises the following steps that a surface image of a to-be-cut plate is collected; according to the surface image of the to-be-...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention provides a plate positioning and cutting method and device, and belongs to the technical field of plate machining. The plate positioning and cutting method comprises the following steps that a surface image of a to-be-cut plate is collected; according to the surface image of the to-be-cut plate, the maximum rectangle which can be cut by the to-be-cut plate is recognized; and according to the maximum rectangle, the to-be-cut plate is cut. The plate positioning and cutting device is used for achieving the plate positioning and cutting method and comprises an image recognition and analysis unit used for collecting the surface image of the to-be-cut plate and analyzing the surface image to obtain the maximum rectangle, and a laser transmitter used for projecting light beams to the to-be-cut plate and connected with the image recognition unit. The cutter is used for cutting a to-be-cut plate, is arranged on the guide rail in a sliding mode in the length direction of the guide rail and can slide in th |
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