Physical layer testing method and device, chip and module equipment
The invention discloses a physical layer test method and device, a chip and module equipment, and the method comprises the steps: obtaining a test case parameter script file which comprises the parameter information of a downlink signal; determining data structure information corresponding to the te...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention discloses a physical layer test method and device, a chip and module equipment, and the method comprises the steps: obtaining a test case parameter script file which comprises the parameter information of a downlink signal; determining data structure information corresponding to the test case parameter script file, wherein the data structure information is used for indicating an association relationship among a plurality of test case parameters; determining a function application platform interface (FAPI) message based on the data structure information, wherein the FAPI message is used for indicating a physical layer to generate a downlink signal based on the FAPI message; and sending the FAPI message to the physical layer. Based on the method described by the invention, the test efficiency of the physical layer subsystem and the reliability of the test parameters can be improved, and the integrity of the physical layer subsystem is ensured.
本申请公开了一种物理层测试方法、装置、芯片及模组设备,该方法包括:获取测试例参数脚本文件,该测试例参数脚本文 |
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