Semiconductor connection structure

The invention relates to a semiconductor connection structure. The semiconductor connection structure comprises a signal line arranged in a substrate; the signal through hole is formed in the substrate and is electrically connected with the signal circuit; the signal welding ball is arranged on the substrate and is electrically connected with the signal through hole; the grounding through hole is formed around the signal through hole; a grounding solder ball disposed around the signal solder ball and electrically connected with the grounding through hole; projection parts of the signal through hole and the signal solder ball on the same horizontal plane are overlapped, and the grounding through hole is located on one side of the signal through hole away from the signal line. According to the semiconductor connection structure, the impedance matching degree of the semiconductor connection structure can be improved, the reflection loss of signals is reduced, and the transmission quality of the signals is improv