Semiconductor device, method for manufacturing semiconductor device, and power conversion device

Provided are a semiconductor device that can be reduced in size and a method for manufacturing the semiconductor device. An internal lead (3e) having chip pads (3a, 3b) on the upper surface of which semiconductor elements (1a, 1b) are mounted has a stepped shape, and a part of the surface of the int...

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Bibliographische Detailangaben
1. Verfasser:	ICHIKAWA, KEITARO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC,OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWERSUPPLY SYSTEMS BASIC ELECTRIC ELEMENTS CONTROL OR REGULATION THEREOF CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUTPOWER CONVERSION OR DISTRIBUTION OF ELECTRIC POWER ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERATION SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	Provided are a semiconductor device that can be reduced in size and a method for manufacturing the semiconductor device. An internal lead (3e) having chip pads (3a, 3b) on the upper surface of which semiconductor elements (1a, 1b) are mounted has a stepped shape, and a part of the surface of the internal lead (3e) is exposed from the encapsulation resin (5) in plan view. An external lead (3f) connected to the internal lead (3e) and connected thereto has a first bent portion (3g) on the side surface of the sealing resin (5) so as to extend in the direction of the upper surface of the die pad (3a), whereby a small-sized semiconductor device can be obtained. 提供能够小型化的半导体装置及半导体装置的制造方法。具有在上表面搭载半导体元件(1a、1b)的芯片焊盘(3a、3b)的内部引线(3e)具有台阶形状，在俯视观察时，内部引线(3e)的一部分的面从封装树脂(5)露出。与内部引线(3e)相连而连结的外部引线(3f)以向芯片焊盘(3a)的上表面的方向延伸的方式，在封装树脂(5)的侧面具有第1弯曲部(3g)，由此能够得到小型化的半导体装置。