SEMICONDUCTOR DEVICE SEALING ASSEMBLY AND MANUFACTURING METHOD THEREOF

The invention discloses a semiconductor equipment sealing assembly and a manufacturing method thereof. The manufacturing method of the semiconductor equipment sealing assembly comprises the following steps: providing a base material; forming a plurality of concave parts on the surface of the base material, wherein the plurality of concave parts are mutually embedded; an elastic body is arranged in the concave part, and the concave part is filled with the elastic body and covered with the elastic body; and vulcanizing the elastomer to form the semiconductor device sealing assembly. According to the semiconductor equipment sealing assembly and the manufacturing method thereof provided by the invention, the performance of the semiconductor equipment sealing assembly is improved, and the manufacturing cost is reduced. 本发明公开了一种半导体设备密封组件及其制作方法，所述半导体设备密封组件的制作方法包括：提供一基材；在所述基材的表面上形成多个凹部，且所述多个凹部相互嵌合；在所述凹部内设置弹性体，且所述弹性体填充并覆盖所述凹部；以及将所述弹性体进行硫化，以形成半导体设备密封组件。通过本发明提供的一种半导体设备密封组件及其制作方法，提高半导体设备密封组件的性能，降低制作成本。