SEMICONDUCTOR DEVICE AND SEMICONDUCTOR CHIP

A semiconductor device according to the present invention is provided with: a support body; a semiconductor chip disposed on the support body; and a chip bonding material that bonds the back surface of the semiconductor chip and the support, in which a plurality of slits are formed at corners formed between the back surface of the semiconductor chip and side surfaces connected to the back surface, and the chip bonding material is integrally provided across the plurality of slits. 本申请的发明所涉及的半导体装置具备：支承体；半导体芯片，设置于支承体之上；以及芯片接合材料，将半导体芯片的背面与支承体接合，在半导体芯片的背面和与背面相连的侧面所形成的角，形成有多个切口，芯片接合材料遍及多个切口而设置为一体。