CURABLE RESIN COMPOSITION, DRY FILM AND CURED PRODUCT THEREOF, AND ELECTRONIC COMPONENT COMPRISING THE CURED PRODUCT

[Problem] To provide: a curable resin composition which has excellent heat resistance and low warpage and is capable of further improving the light transmittance of a cured product; a dry film and a cured product thereof; and an electronic component comprising the cured product. [Solution] A curable resin composition characterized by containing (A) an amide-imide resin, (B) a thermosetting resin, (C) a thermosetting accelerator, and (D) inorganic particles, a dry film and a cured product thereof, and an electronic component containing the cured product are obtained. (A) The amide-imide resin is a reaction product of an isocyanurate-type polyisocyanate synthesized from an isocyanate having an aliphatic structure and a tricarboxylic acid anhydride having an aliphatic structure, and has a number average molecular weight of 500-1000. [课题]提供：具有优异的耐热性、低翘曲性、能进一步改善固化物的透光率的、固化性树脂组合物、其干膜和固化物、以及包含该固化物的电子部件。[解决方案]得到了固化性树脂组合物、其干膜和固化物、以及包含该固化物的电子部件，所述固化性树脂组合物的特征在于，包含：(A)酰胺酰亚胺树脂、(B)热固性树脂、(C)热固化促进剂、和(D)无机颗粒，(A)酰胺酰亚胺树脂为由具有脂肪族