SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

A semiconductor package and a method of manufacturing the same. An electronic device includes a signal redistribution structure (SRS) including an SRS top side, an SRS bottom side, and a plurality of SRS lateral sides, where the signal redistribution structure is coreless; a lower electronic component (LEC) including an LEC top side, an LEC bottom side, and a plurality of LEC lateral sides, where the LEC top side is coupled to the SRS bottom side; a vertical interconnect structure coupled to the SRS bottom side at a position laterally offset from the lower electronic component; an LEC interconnect structure coupled to the LEC top side and the SRS bottom side such that the lower electronic component is electrically coupled to the signal redistribution structure through at least the LEC interconnect structure; a semiconductor die including a die top side, a die bottom side, and a plurality of die lateral sides; a first die interconnect structure coupled to the SRS top side and the die bottom side such that the