SUBSTRATE PROCESSING APPARATUS AND INSULATING MEMBER

The invention provides a substrate processing apparatus and a heat insulation member capable of reducing heat dissipation of a chamber. A substrate processing apparatus (1) is an apparatus for heating a substrate (9). A substrate processing apparatus (1) is provided with a chamber (2), a plurality of support pins (3), and a heat plate (4). A plurality of support pins (3) support the substrate (9) within the chamber (2). The heat plate (4) heats the substrate supported by the plurality of support pins (3). The inner surface of the chamber (2) is configured from a first fiber-reinforced resin layer. The outer surface of the chamber (2) is configured from a second fiber-reinforced resin layer. 本发明提供一种减轻腔室的散热的基板处理装置及隔热构件。基板处理装置(1)为对基板(9)进行加热的装置。基板处理装置(1)具有腔室(2)、多个支撑销(3)及热板(4)。多个支撑销(3)在腔室(2)内支撑基板(9)。热板(4)对被多个支撑销(3)支撑的基板进行加热。腔室(2)的内侧表面由第一纤维强化树脂层构成。腔室(2)的外侧表面由第二纤维强化树脂层构成。