Material tracking method

The material tracking method comprises the following steps: executing a first marking operation in a specified area on the surface of a material according to a first laser parameter to form a first identification code; etching operation is executed in the designated area according to a second laser parameter so as to remove the first identification code; and second marking operation is executed in the designated area according to a third laser parameter to form a second identification code. According to the material tracking method, an original identification code is removed in the same area in a laser etching mode, and secondary marking is performed on the etched surface to form a new identification code, so that the area occupied by the identification code on the material is reduced. 一种物料追踪方法包括：以第一激光参数在物料表面的指定区域内执行第一打标操作以形成第一识别码；以第二激光参数在所述指定区域执行刻蚀操作以将所述第一识别码移除；以第三激光参数在所述指定区域内执行第二打标操作以形成第二识别码。该物料追踪方法通过在同一区域通过激光刻蚀方式移除原有识别码并以刻蚀后的表面进行二次打标形成新的识别码，以减少物料上识别码占用的面积。