SOLDER COMPOSITION AND ELECTRONIC SUBSTRATE

A solder composition according to the present invention contains a flux composition containing (A) a rosin-based resin, (B) an activator, (C) an imidazoline compound having a phenyl group, and (D) an antioxidant, and is characterized in that the component (B) contains (B1) an organic acid, the component (B1) contains (B11) a component selected from the group consisting of 1-hydroxy-2-naphthoic acid, 3-hydroxy-2-naphthoic acid, and 1, 3-dihydroxy-2-naphthoic acid, and (B12) a component selected from the group consisting of 1-hydroxy-2-naphthoic acid, 3-hydroxy-2-naphthoic acid, and 1, 3-dihydroxy-2-naphthoic acid, and 1, 3-dihydroxy-2-naphthoic acid; the component (C) is at least one selected from the group consisting of 2-phenylimidazoline and 2-benzylimidazoline, and the component (C) is at least one selected from the group consisting of 1, 4-dihydroxy-2-naphthoic acid and 1, 4-dihydroxy-2-naphthoic acid. 本发明的焊料组合物的特征在于，其含有助焊剂组合物和(E)焊料粉末，所述助焊剂组合物含有(A)松香类树脂、(B)活化剂、(C)具有苯基的咪唑啉化合物、(D)抗氧化剂，所述(B)成分含有(B1)有机酸，所述(B1