Flux composition, flux, and solder paste

The present invention addresses the problem of suppressing residue cracks in flux residues. The present invention provides a flux composition comprising one or more first rosin compounds selected from the group consisting of an imidized maleic acid-modified rosin and a hydride of the imidized maleic...

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Bibliographische Detailangaben
Hauptverfasser:	MIYAGI NANAKO, KAWASAKI HIROYOSHI, SHIRATORI MASATO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	The present invention addresses the problem of suppressing residue cracks in flux residues. The present invention provides a flux composition comprising one or more first rosin compounds selected from the group consisting of an imidized maleic acid-modified rosin and a hydride of the imidized maleic acid-modified rosin. Furthermore, the present invention provides a flux which contains the composition for flux and is used for soldering a solder alloy. Furthermore, the present invention provides a solder paste containing the flux and a solder alloy. 本发明的课题是抑制助焊剂残渣的残渣裂纹。本发明提供一种助焊剂用组合物，其中，包含从由酰亚胺化的马来酸改性松香、以及酰亚胺化的马来酸改性松香的氢化物所组成的组中选择的一种或两种以上的第一松香化合物。另外，本发明提供一种助焊剂，其中，包含该助焊剂用组合物，并且用于焊接焊料合金。另外，本发明提供一种焊膏，其中，包含该助焊剂和焊料合金。