Chip slice smearing process

The invention discloses a chip slice coating process which comprises a machine shell, the machine shell is provided with a functional cavity communicated with the outside, a cutting frame is fixedly connected in the rear end wall of the functional cavity, the cutting frame is fixedly connected with a sleeve core, the sleeve core is slidably connected with a sleeve shaft, a clamping cavity is formed in the sleeve shaft, a cutting mechanism, a positioning mechanism and a film coating mechanism are arranged in the machine shell, and a sliding plate is arranged. The silicon crystal bar can be zeroed, then the length of the silicon crystal bar is detected through the signal transmitter, and then the number of cutters is adjusted, so that the requirements for machining the silicon crystal bars of different length specifications are met, the range of machined objects is widened, cost is saved, waste is reduced, the process of manual zeroing trial cutting is reduced, and accuracy is improved. By means of the arranged