Waterproof fingerprint module structure
A fingerprint module comprises a metal ring, a first groove and a second groove are formed in the upper end of the metal ring, a through hole is formed in the metal ring in an up-down penetrating mode, the through hole communicates with the first groove, a left protrusion and a right protrusion are...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | A fingerprint module comprises a metal ring, a first groove and a second groove are formed in the upper end of the metal ring, a through hole is formed in the metal ring in an up-down penetrating mode, the through hole communicates with the first groove, a left protrusion and a right protrusion are arranged on the left side wall and the right side wall of the lower end of the metal ring respectively, and a smoothing section is arranged at the lower end of the right protrusion. A first sealing glue layer, a first reinforcing layer, a substrate and a chip are arranged in the first groove, a second sealing glue layer is arranged in the through hole, the substrate located in the through hole is wrapped in the second sealing glue layer, and sealing structure glue layers are arranged at the joints of the substrate and the left and right ends of the chip. According to the invention, the first groove and the second groove are arranged, and the depth of the first groove and the depth of the second groove are adjustabl |
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