Physical cutting method for magnetic base material

The invention discloses a physical cutting method for a magnetic base material, which is used for cutting microwave ferrite substrates with different thicknesses, and the optimal range of process cutting parameters is as follows: the rotating speed of a main shaft of a cutting machine is 25,000-35,000 r/min; the cutting speed is 1.0 to 5.0 mm/min; the cutting depth is d + 0.01 mm-d + 0.03 mm of the thickness of the magnetic base material, the number of times of cutting is 1-2, or the number of times of cutting is increased according to the thickness of the base material, a circular cutter made of a resin diamond material is adopted, and the cutting temperature is controlled within the range of 21 +/-1 DEG C. According to the invention, the size of broken edges is reduced, the number of broken chips is small, the qualified rate is high, the chip discharging speed is high, and batch and large-scale production of microwave ferrite devices can be realized. 本发明公开了一种磁性基材的物理切割方法，对不同厚度的微波铁氧体基板进行切割，工艺切割参数的最优范围为：切割机主轴转