Dynamic process control in semiconductor fabrication

Methods and systems for dynamic process control in substrate processing, such as in semiconductor manufacturing applications, are provided. Some example systems and methods are provided for advanced monitoring and machine learning in atomic layer deposition (ALD) processes. Some examples also relate to dynamic process control and monitoring for chamber parameter matching and gas line fill time. 提供了用于衬底处理中，例如在半导体制造应用中的动态工艺控制的方法和系统。提供了一些示例系统和方法，其用于原子层沉积(ALD)工艺中的高级监控和机器学习。一些示例还涉及用于室参数匹配和气体管线填充时间的动态工艺控制和监控。