Circuit board, manufacturing method thereof and electronic equipment

The invention discloses a circuit board, a manufacturing method thereof and electronic equipment, and the manufacturing method of the circuit board comprises the steps: providing a circuit substrate which comprises a base layer and a conductive layer; covering an anti-corrosion layer on the conductive layer; wherein the anti-corrosion layer comprises a shielding area and a hollow area, and a chamfer formed by two adjacent edges in the shielding area is provided with a convex part which is convex outwards or a concave part which is concave inwards; and etching the conductive layer based on the etching pattern. Through the mode, the manufacturing precision of the circuit board is improved, and the product yield is improved. 本申请公开了一种电路板及其制作方法、电子设备，其中，该电路板的制作方法包括：提供一电路基板，所述电路基板包括基层和导电层；在所述导电层上覆盖抗蚀层；其中，所述抗蚀层包括遮挡区域和镂空区域，所述遮挡区域中相邻两条边形成的倒角设有外凸的凸出部或内陷的凹陷部；基于所述蚀刻图形对所述导电层进行蚀刻。通过上述方式，提高了电路板的制作精度，提高产品良率。