Printed circuit board and wiring layout method thereof

The invention provides a printed circuit board and a wiring layout method thereof, the printed circuit board comprises a packaging chip and at least two connectors, and wiring of the packaging chip connected with different connectors is distributed in different board layers; and when the packaging c...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: FENG CHENXIA, WU CHUNMEI, LI JING, HUANG HAIJU
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention provides a printed circuit board and a wiring layout method thereof, the printed circuit board comprises a packaging chip and at least two connectors, and wiring of the packaging chip connected with different connectors is distributed in different board layers; and when the packaging chip is connected with one of the connectors, a high-speed path from the packaging chip to the connector is formed by the via hole back drilling, and the copper walls of the board layers corresponding to the other connectors are drilled off. According to the invention, the wires for connecting different connectors through the packaging chip are distributed in different board layers; when the packaging chip is connected with one of the connectors, through back drilling of different depths, the via hole back drilling forms a high-speed path from the packaging chip to the connector, and copper walls of board layers corresponding to other connectors are drilled off, so that two or more printed circuit boards do not need