SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF FORMING THE SAME

A semiconductor device package and a method of forming a semiconductor device package are provided. The semiconductor device package includes a substrate, a first package component, a second package component, and at least one dummy die. The first package component and the second package component are disposed on the substrate and bonded to the substrate. The first package component and the second package component are different types of electronic components providing different functions. The dummy die is disposed over and attached to the substrate. The dummy die is located between the first package component and the second package component and is electrically isolated from the substrate. 提供一种半导体装置封装以及形成半导体装置封装的方法。半导体装置封装包括基板、第一封装部件、第二封装部件、以及至少一个虚设晶粒。第一封装部件以及第二封装部件设置于基板之上，且结合至基板。第一封装部件以及第二封装部件为提供不同功能的不同类型的电子部件。虚设晶粒设置于基板之上，且附接至基板。虚设晶粒位在第一封装部件以及第二封装部件之间，且与基板电性隔绝。