Ultra-precision machining polishing grinding wheel for large-size monocrystalline silicon wafer and preparation method of ultra-precision machining polishing grinding wheel

The invention discloses a large-size monocrystalline silicon wafer ultra-precision machining polishing grinding wheel and a preparation method thereof, and relates to the technical field of grinding wheel manufacturing. The manufacturing method comprises the following steps that firstly, a modified high-polymer-based epoxy resin binding agent and the diamond abrasive are compounded, a high-strength polymer is obtained after compounding is completed, and the modified high-polymer-based epoxy resin binding agent is formed by mixing polyacrylate, phenolic resin and potassium fluoroborate according to the mass ratio of 1: (1-1.2): (1-1.3); the ultra-precise grinding and polishing requirements of the large-size wafer are met, the grinding tool is large in size, the degree of finish reaches the nanoscale, balance and consistency are achieved, and no metamorphic layer damage is caused to the crystal structure of the surface of the wafer in the grinding process; a high-strength waterproof anti-burn self-lubricating e