Thermoelectric device

A thermoelectric device according to one exemplary embodiment of the present invention comprises: a heat dissipation member in which a groove is formed; the first electrode is arranged in the groove; a semiconductor structure disposed on the first electrode; a second electrode disposed on the semiconductor structure; a substrate disposed on the second electrode; and a sealing member disposed between the substrate and a sidewall of the recess. 根据本发明的一个示例性实施例的热电装置包括：散热构件，其中形成有凹槽；第一电极，设置在凹槽中；半导体结构，设置在第一电极上；第二电极，设置在半导体结构上；基板，设置在第二电极上；以及密封构件，设置在基板与凹槽的侧壁之间。