Camera module sub-components attached via vertically spread adhesive

The present disclosure relates to camera module sub-components attached via a vertically spread adhesive. A camera module is provided that may be assembled from a base part formed from a horizontal surface and having a raised wall extending vertically from the horizontal surface, and a housing part...

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Bibliographische Detailangaben
Hauptverfasser:	CHUN NAM CHI, HOWELL JOHN CHUA TOC, MAGCHIRON, JEFFREY, C, HONTIVELOS, ANTHONY, B
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CALCULATING CHEMISTRY COMPUTING COUNTING DYES ELECTRIC COMMUNICATION TECHNIQUE ELECTRIC DIGITAL DATA PROCESSING ELECTRICITY METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS PHYSICS POLISHES TELEPHONIC COMMUNICATION USE OF MATERIALS AS ADHESIVES
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