Camera module sub-components attached via vertically spread adhesive
The present disclosure relates to camera module sub-components attached via a vertically spread adhesive. A camera module is provided that may be assembled from a base part formed from a horizontal surface and having a raised wall extending vertically from the horizontal surface, and a housing part...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The present disclosure relates to camera module sub-components attached via a vertically spread adhesive. A camera module is provided that may be assembled from a base part formed from a horizontal surface and having a raised wall extending vertically from the horizontal surface, and a housing part having a vertical surface attached to the raised wall of the base part with an adhesive. Assembly of the camera module may include dispensing an adhesive along a top edge of the raised wall to partially depend on the edge, and placing the housing member down onto the base member. During assembly, the adhesive distributed on the top surface of the raised wall may be sheared or otherwise distributed by the action of a corresponding wall of the housing part moving past the top surface, and such that at least some of the adhesives spread between opposite surfaces of the base member and the respective vertical walls of the housing member of the camera. The adhesive is then cured.
本公开涉及经由竖直铺展的粘合剂来附接的相机模块子部件。提供了一种相机模块,该相机 |
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