Chip packaging structure

The invention relates to the technical field of chip packaging, in particular to a chip packaging structure. The chip packaging structure comprises a packaging shell, a substrate and a chip main body, the packaging shell is internally provided with a packaging cavity, and the packaging shell is provided with an air inlet hole and an air outlet hole which are communicated with the packaging cavity; the air inlet hole is formed in the side wall of the packaging shell, and the air outlet hole is formed in the top wall of the packaging shell; the substrate is arranged in the packaging cavity; the chip main body is installed on the substrate and located between the substrate and the top wall of the packaging shell, and at least part of the chip main body is located on a circulation path between the air inlet hole and the air outlet hole. According to the chip packaging structure provided by the invention, the heat dissipation performance of the chip can be effectively improved, and the occupied space is relatively