Degassing chamber and semiconductor process equipment

The invention discloses a degassing chamber and semiconductor process equipment, the degassing chamber comprises a chamber body, a heating device and a shading plate, the heating device is arranged above the chamber body along the height direction of the degassing chamber, the heating device is used...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: HU SHUOPENG
Format: Patent
Sprache:chi ; eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:The invention discloses a degassing chamber and semiconductor process equipment, the degassing chamber comprises a chamber body, a heating device and a shading plate, the heating device is arranged above the chamber body along the height direction of the degassing chamber, the heating device is used for projecting light rays to a wafer placed in the chamber body, and the shading plate is arranged above the chamber body. The heating module is used for heating the wafer; a plurality of through light transmission holes are formed in the light shielding plate, and the light transmission holes are used for allowing the light to pass through; the light shielding plate has a first state and a second state, and under the condition that the light shielding plate is in the first state, the light shielding plate avoids a light path of the light; and under the condition that the light shielding plate is in the second state, the light shielding plate is located on the light path of the light. According to the scheme, the