Method for reducing particles generated in PECVD (plasma enhanced chemical vapor deposition) film deposition process

The invention discloses a method for reducing particles generated in the PECVD thin film deposition process. The method comprises the following steps that S1, a wafer is conveyed into a PECVD cavity through a conveying mechanism and preheated; s2, side reaction gas in the process gas is introduced i...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LIU PENGFEI, XU KAIDONG, CHOI HO-SAN, LYU XIANFENG, FAN SIDA, DING XIAOLIN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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