Epoxy resin grouting material and application

The invention discloses an epoxy resin grouting material and application, the epoxy resin grouting material comprises a component A and a component B, and the component A and the component B are mixed according to a mass ratio of 2: 1-5: 1 during use; the component A comprises the following componen...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: LIN YIJUN, ZHOU CHULU, XI ZHIWEI, WANG LIJIE
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention discloses an epoxy resin grouting material and application, the epoxy resin grouting material comprises a component A and a component B, and the component A and the component B are mixed according to a mass ratio of 2: 1-5: 1 during use; the component A comprises the following components in parts by mass: 30-50 parts of epoxy resin, 10-30 parts of an active diluent, 15-40 parts of an active penetrant, 2-6 parts of a coupling agent and 1-8 parts of a surfactant; the component B comprises 55-110 parts of phenolic aldehyde amine, 5-15 parts of a curing accelerator and 1-5 parts of an activator of a penetrating agent; the active penetrant is selected from one or two of low-toxicity low-viscosity carbonyl aldehyde and low-volatility low-viscosity carbonyl ketone. In the formula of the epoxy grouting material, the low-viscosity carbonyl aldehyde and ketone are matched with the reactive diluent and the surfactant for use, so that the lowest viscosity of the grouting material is 10cp, the solid-liquid p