Temperature optimization design method and system for reducing buckling deformation of PCB after lamination

The invention discloses a temperature optimization design method and system for reducing buckling deformation of a PCB after lamination, and the method comprises the steps: carrying out the layering modeling of the PCB, carrying out the partitioning of a mixed layer, and defining an equivalent mater...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	MORIO, WAN GUOSHUN, HUANG BIN, ZHAO ZHIYAN, JIA YUXI, CHENG MENGXUAN, ZHANG TONG, ZHENG RUIQIAN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CALCULATING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS COMPUTING COUNTING ELECTRIC DIGITAL DATA PROCESSING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PHYSICS PRINTED CIRCUITS
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