Temperature optimization design method and system for reducing buckling deformation of PCB after lamination

The invention discloses a temperature optimization design method and system for reducing buckling deformation of a PCB after lamination, and the method comprises the steps: carrying out the layering modeling of the PCB, carrying out the partitioning of a mixed layer, and defining an equivalent material performance parameter in each region; calculating a temperature field and a curing degree field of resin in the PCB; determining the highest curing temperature of the PCB in the thermocompression bonding stage; obtaining a thermal strain field and a chemical shrinkage strain field of the composite material in the PCB based on the temperature field and the curing degree field; numerical simulation of PCB press-fit forming is carried out, and the buckling deformation amount of the PCB at the highest curing temperature is obtained; and changing the maximum curing temperature of the PCB in the press-fit forming numerical simulation process to obtain the buckling deformation of the PCB after press-fit forming at dif