Integrated assembly and method of forming integrated assembly

The invention relates to an integrated assembly and a method of forming an integrated assembly. Some embodiments include a method of forming an integrated assembly. A semiconductor material is patterned into a configuration including a set of first upwardly protruding structures spaced apart from ea...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	FAN DARWIN FRANSEDA, MUTHUKRISHNAN KARTHIK KUMAR, CHEN ZHUO, VASILYEVA IRINA V
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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