Thin film and thick film hybrid integrated ceramic substrate and preparation method thereof
The invention discloses a thin film/thick film hybrid integrated ceramic substrate, which specifically comprises a thin film ceramic substrate prepared by a semiconductor thin film process and a thick film ceramic substrate prepared by a pattern electroplating process, and the thin film ceramic subs...
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| creator | LIU SONGPO HUANG WEIJUN |
| description | The invention discloses a thin film/thick film hybrid integrated ceramic substrate, which specifically comprises a thin film ceramic substrate prepared by a semiconductor thin film process and a thick film ceramic substrate prepared by a pattern electroplating process, and the thin film ceramic substrate and the thick film ceramic substrate share the same ceramic substrate and are electrically connected through a surface metal layer. Wherein the thin-film ceramic substrate comprises a thin-film multilayer wiring, a metal through hole and a gold-tin alloy layer, and is used as a digital/control circuit of a resistor, an inductor, a capacitor and the like; the thick-film ceramic substrate comprises a thick metal layer and a metal through hole and is used for packaging a power device. The invention also discloses a preparation method of the thin film/thick film hybrid integrated ceramic substrate. According to the invention, the thin film and pattern electroplating process is implemented on the same ceramic subs |
| format | Patent |
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Wherein the thin-film ceramic substrate comprises a thin-film multilayer wiring, a metal through hole and a gold-tin alloy layer, and is used as a digital/control circuit of a resistor, an inductor, a capacitor and the like; the thick-film ceramic substrate comprises a thick metal layer and a metal through hole and is used for packaging a power device. The invention also discloses a preparation method of the thin film/thick film hybrid integrated ceramic substrate. 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Wherein the thin-film ceramic substrate comprises a thin-film multilayer wiring, a metal through hole and a gold-tin alloy layer, and is used as a digital/control circuit of a resistor, an inductor, a capacitor and the like; the thick-film ceramic substrate comprises a thick metal layer and a metal through hole and is used for packaging a power device. The invention also discloses a preparation method of the thin film/thick film hybrid integrated ceramic substrate. 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Wherein the thin-film ceramic substrate comprises a thin-film multilayer wiring, a metal through hole and a gold-tin alloy layer, and is used as a digital/control circuit of a resistor, an inductor, a capacitor and the like; the thick-film ceramic substrate comprises a thick metal layer and a metal through hole and is used for packaging a power device. The invention also discloses a preparation method of the thin film/thick film hybrid integrated ceramic substrate. According to the invention, the thin film and pattern electroplating process is implemented on the same ceramic subs</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
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| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
| title | Thin film and thick film hybrid integrated ceramic substrate and preparation method thereof |
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