Thin film and thick film hybrid integrated ceramic substrate and preparation method thereof

The invention discloses a thin film/thick film hybrid integrated ceramic substrate, which specifically comprises a thin film ceramic substrate prepared by a semiconductor thin film process and a thick film ceramic substrate prepared by a pattern electroplating process, and the thin film ceramic substrate and the thick film ceramic substrate share the same ceramic substrate and are electrically connected through a surface metal layer. Wherein the thin-film ceramic substrate comprises a thin-film multilayer wiring, a metal through hole and a gold-tin alloy layer, and is used as a digital/control circuit of a resistor, an inductor, a capacitor and the like; the thick-film ceramic substrate comprises a thick metal layer and a metal through hole and is used for packaging a power device. The invention also discloses a preparation method of the thin film/thick film hybrid integrated ceramic substrate. According to the invention, the thin film and pattern electroplating process is implemented on the same ceramic subs