Method and electronic module for thermally spraying conductor tracks

The invention relates to a method for thermally spraying at least one conductor track (20) formed from a first metal and electrically conductive material (40). The at least one conductor track is additionally sprayed by means of at least one second metal material (50), which has a lower melting poin...

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Bibliographische Detailangaben
Hauptverfasser: RAAB OLIVER, STEGMEIER, STEFAN
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention relates to a method for thermally spraying at least one conductor track (20) formed from a first metal and electrically conductive material (40). The at least one conductor track is additionally sprayed by means of at least one second metal material (50), which has a lower melting point than the first material (40). The electronic module has at least one conductor track (20), the conductor track (20) being formed from a first electrically conductive material (40) and additionally from a second metal material (50), the second material (50) having a lower melting point than the first material (40), and the first material (40) and the second material (50) being mutually diffused, in particular alloyed and/or mixed. 本发明涉及一种用于热喷涂至少一个利用第一金属的且导电的材料(40)形成的导体线路(20)的方法。至少一个导体线路附加地借助至少一个第二金属材料(50)喷涂,第二金属材料与第一材料(40)相比具有较低的熔点。电子模块具有至少一个导体线路(20),其中,导体线路(20)利用第一导电材料(40)并且附加地借助第二金属材料(50)形成,其中,第二材料(50)与第一材料(40)相比具有较低的熔点,并且其中,第一材料(40)和第二材料(50)相互扩散、尤其是合金化和/或混合。