Substrate arrangement using camera wafer

A method includes disposing a device on a top surface of a susceptor in a processing chamber. The device comprises: an annular member; n support members; and N pins, wherein N is an integer greater than 2. N support members support the annular member in a plane parallel to the top surface of the bas...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	TAN TED, VEMPRATHERT, BUNIARIT, FIEDLER SHAWN, BATZER, RACHEL, E, KRISHNASWAMY, VIVEKANANDAN, KULKARNI, PRASANNA
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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