Substrate arrangement using camera wafer

A method includes disposing a device on a top surface of a susceptor in a processing chamber. The device comprises: an annular member; n support members; and N pins, wherein N is an integer greater than 2. N support members support the annular member in a plane parallel to the top surface of the base and above the top surface. The N pins are arranged perpendicular to a plane along a circumference around the annular member. Each of the N pins includes threads engageable with a respective threaded slot in the device. Each of the N pins includes a tapered endpoint directed toward the top surface of the base and engageable with a periphery of the top surface of the base. The method also includes aligning a center of the annular member with a center of the base by adjusting one or more of the N pins. 一种方法包含：将装置布置于处理室中的基座的顶表面上。所述装置包含：环形构件；N个支撑构件；以及N个销，其中N为大于2的整数。N个支撑构件将所述环形构件支撑于与所述基座的所述顶表面平行的平面中且支撑于所述顶表面上方。所述N个销垂直于沿着环绕所述环形构件的圆周的平面而布置。所述N个销中的每一个包含能够与所述装置中的相应螺纹槽啮合的螺纹。所述N个销中的每一个包含指向所述基座的所述顶表面且能与所述基座的所述顶表面的周围接合的锥状端点。所述