Thermosetting resin composition for light reflection, substrate for mounting optical semiconductor element, and optical semiconductor device

This thermosetting resin composition for light reflection contains an epoxy resin, a curing agent, an inorganic filler, and a white pigment, wherein the curing agent contains a tetracarboxylic dianhydride having a melting point of 180-400 DEG C. 本发明所涉及的光反射用热固性树脂组合物含有环氧树脂、固化剂、无机填充剂及白色颜料，固化剂含有熔点为180～4...

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Bibliographische Detailangaben
Hauptverfasser:	NARA NAOKI, INABA KIICHI, SUDO HIKARU, YAMAMOTO TAKASHI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	This thermosetting resin composition for light reflection contains an epoxy resin, a curing agent, an inorganic filler, and a white pigment, wherein the curing agent contains a tetracarboxylic dianhydride having a melting point of 180-400 DEG C. 本发明所涉及的光反射用热固性树脂组合物含有环氧树脂、固化剂、无机填充剂及白色颜料，固化剂含有熔点为180～400℃的四羧酸二酐。